ASUS Announces World's first AMD-Based Motherboard with PCI Express 3.0
ASUS
Announces World’s first AMD-Based Motherboard with PCI Express 3.0
ASUS today announced the TUF
Series SABERTOOTH 990FX/GEN3 R2.0, the
world’s first AMD-based motherboard to feature PCI Express 3.0 for use
with nextgeneration high performance
graphics cards. Up to three DirectX® 11 graphics cards with 28nm GPU
technology can be used via NVIDIA® SLI™ or AMD CrossFireX™ to create desktop PCs
with formidable graphics performance.
SABERTOOTH
990FX/GEN3 R2.0 also features renowned ASUS TUF Series thermal design for
superior heat removal. Like all TUF Series motherboards, it undergoes military
and server-grade testing to ensure absolute stability, reliability, and
longevity. SABERTOOTH 990FX/GEN3 R2.0 is backed by a
five-year warranty.
Military-grade components for superior
reliability
SABERTOOTH
990FX/GEN3 R2.0 meets strict TUF Series quality assurance standards, which
consist of multiple-stage military and server-grade tests. TUF-certified alloy
chokes, together with solid state capacitors and MOSFETs, ensure complete
reliability even when the motherboard is subjected to intense use for prolonged
periods. Four DIMM slots support up to 32GB DDR3 memory at frequencies up to
2400MHz, aided by an eight-layered PCB that promotes faster memory performance
while ensuring stability and compatibility with improved cross-component signal
quality.
Sophisticated thermal management copes with
extreme heat
TUF Series
motherboards are designed to provide absolute stability and reliability under
harsh operating conditions, and feature sophisticated thermal management to handle
extreme heat. Both the Northbridge and Southbridge use dual-heatpipe heatsinks
with CeraM!X micro-ridged coating that increases the effective heat dissipation
surface area by around 50%.
SABERTOOTH
990FX/GEN3 R2.0 also features TUF Thermal Radar, which uses multiple heat
sensors across the motherboard for real time temperature monitoring.
Independent and automatic fan speed control then allows components to be cooled
individually for maximum efficiency and operating stability.