Xeon E5-2600シリーズデュアルCPU対応/最大512GBメモリ/Half SSI

    Through innovative ASUS design, it offers high density and high performance computing with extensive I/O expandability. Users also obtain greater manageability via the latest ASMB6-iKVM. The series is ideal as a computing node in HPC and IPDC markets, or in any applications that require true high density.
      Product Image

      High density datacenter and high performance computing

      High density 16–DIMM memory design

      ASUS Z9PH-D16 boards are equipped with 16 DDR3-1600 DIMM slots in a half-size serverboard, providing high density for datacenter environments, with up to 25% more bandwidth compared to previous DDR3-1333 technology. Support for new LRDIMM gives customers access to as much as 32GB per memory module. With LRDIMM onboard, the Z9PH-D16 Series can take up to 512GB.

      New InfiniBand® QDR connectivity (Z9PH-D16/QDR)

      With discrete Mellanox ConnectX-3, the Z9PH-D16/QDR increases networking I/O abilities and improves green data center efficiency. High density, high bandwidth, and low latency all combine on a half SSI-sized serverbord.

      ASMB6-iKVM upgrade kit for easy troubleshooting

      The ASMB6-iKVM enables dashboard system health monitoring, remote power on/off and control, virtual media over LAN, and management LAN fail-over support. In addition, the ASMB6 function is based on BIOS-level access, so even if the server operating system is down or offline, the KVM module can still provide round-the-clock remote monitoring and diagnosis through a user-friendly web-based graphical interface through all major browsers.

      Cutting-edge architecture

      The Z9PH-D16 Series supports new Intel® E5-2600 series processors (Sandy Bridge-EP). Through the expertise of ASUS research and development, the series is also ready to support upcoming E5-2600 V2 processors (Ivy Bridge-EP), protecting customer investment with improved future-proofing. Alongside new Intel® E5-2600 series processors, the Z9PH-D16/QDR provides new PCI Express 3.0 expandability, which offers higher bandwidth (up to 8GT per lane) to meet the requirements of intense HPC applications.