TUF /tΛf/, stands for The Ultimate Force.
The TUF series delivers a “tough” image. With the unique design & high quality components (military-standard), TUF series is born for pursuing the preeminent stability, all-round compatibility, and extreme durability.
Learn More About TUF
PCIe 3.0 Support
PCI Express® 3.0
PCI Express® 3.0 (PCIe 3.0) is the latest PCI Express bus standard with improved encoding schemes that provide twice the performance of current PCIe 2.0. Total bandwidth for a x16 link reaches a maximum of 32GB/s, double the 16GB/s of PCIe 2.0 (in x16 mode). As such, PCIe 3.0 provides users unprecedented data speeds, combined with the convenience and seamless transition offered by complete backward compatibility with PCIe 1.0 and PCIe 2.0 devices. PCIe 3.0 will become a must-have feature for users who wish to improve and optimize graphic performance, as well as have the latest technology available to them.
CeraM!X - Heatsink Coating Tech.
Larger Area for Heat Dissipation with The Revolutionary Ceramics-Coating Technology
Innovative ceramics effectively conducts heat away from the system. It replaces traditional anti-oxidant to dissipate heat better with its microscopic irregular surface and enlarged area. Better cooling leads to overall improvement in system stability.
TUF Thermal Radar
Real Time Temp Detection and Heat Removal
The TUF Thermal Radar monitors temps in critical parts of the motherboard in real time, automatically adjusting fan speeds to make sure the system maintains high stability without overheating. It consists of multiple sensors for various components on the motherboard, giving users the ability to monitor each area, while increasing options for fan control housed inside the chassis. The Thermal Radar automatically calculates ideal fan speeds based on different parameters selected by users for each component, keeping everything cooler and longer lasting.
New DIGI+ Power Control
Leading Digital Power Control Solution with The Best Quality
New DIGI+ Power Control includes multiple digital voltage controllers, allowing ultra-precise modulation and tuning for both the CPU and DRAM. This innovative and industry-leading ASUS technology provides extremely accurate voltage tuning for better efficiency, stability and performance.
TUF Components (Alloy Choke, Cap. & MOSFET; Certified by Military-standard)
Certified for Tough Duty
Get rugged performance even in the most challenging conditions with robust TUF chokes, solid capacitors, and MOSFETs--certified through third-party, military-grade testing. TUF Chokes, also known as the “Alloy Choke”, is a made of a compound of various types of metal instead standard iron, enables the support of up to a massive 40A of rated current, 25% higher than conventional component. Furthermore, the single piece packaging also elimates the emission of virbation noise, delivering superb charactoristics as well as durability under extreme conditions.
Any Memory is A-OK!
MemOK! quickly ensures memory boot compatibility. This remarkable memory rescue tool requires a mere push of a button to patch memory issues. MemOK! determines failsafe settings and dramatically improves your system boot success. Get your system up and running in no time!
Unique Protection of Motherboard Components from Unexpected Electrostatic Discharges (ESD)
Electrostatic discharge (ESD) can happen suddenly and its damaging effects is often underestimated. Exclusive ASUS anti-static chip, a protective circuit design, and the I/O shield provides four times better protection to extend component lifespan.
Flexible and Easy BIOS Interface
ASUS UEFI BIOS offers a user-friendly interface that goes beyond traditional keyboard-only BIOS controls to enable more flexible and convenient mouse input. Users can easily navigate the UEFI BIOS with the smoothness of their operating system. Quick and simple overclocking and setup sharing is facilitated by the F12 hotkey BIOS snapshot feature. The exclusive EZ Mode displays frequently-accessed setup info, while the Advanced Mode is for experienced performance enthusiasts that demand far more intricate system control, including detailed DRAM information.
CPU, Chipset and Graphics features
AMD® Socket AM3+ for AMD® FX Series CPU up to 8-core
This motherboard supports latest AMD® Socket AM3+ multi-core processors with up to 8-core native CPU cores and delivers better overclocking capabilities with less power consumption. It features AMD Turbo CORE Technology 2.0 and accelerates data transfer rate up to 5200MT/s via HyperTransport™ 3.0 based system bus. This motherboard also supports AMD® CPUs in the new 32nm manufacturing process.
AMD® 990FX Chipset
AMD 990FX Chipset is designed to support up to 5.2GT/s HyperTransport™ 3.0 (HT 3.0) interface speed and dual PCI Express™ 2.0 x16 graphics. It is optimized with AMD latest AM3+ and multi-core CPUs to provide excellent system performance and overclocking capabilities.
Quad-GPU SLI and Quad-GPU CrossFireX Support!
Flexible Multi-GPU solutions, Your Weapon of Choice!
SABERTOOTH 990FX/GEN3 R2.0 brings multi-GPU configurations through both SLI™ and CrossFireX. This motherboard features the powerful AMD® 990FX/SB950 platform, optimizing PCIe allocation in multiple GPU configurations. Expect a brand new gaming style like you’ve never experienced before!
SABERTOOTH 990FX/GEN3 R2.0 Product Overview
5 Year Warranty
The ultimate reliability of TUF Series is not only based on advanced thermal design, military-standard components and strict reliability tests, but also on the 5 Years Warranty* which is proudly provided.
* This service will follow the local standard and service policy.
** This service only covers failures or malfunctions that occur during the warranty period and under normal use conditions, as well as any material or workmanship defects.
The motherboard is European Union´s Energy-related Products (ErP) ready, and ErP requires products to meet certain energy efficiency requirements in regards to energy consumptions. This is in line with ASUS vision of creating environment-friendly and energy-efficient products through product design and innovation to reduce carbon footprint of the product and thus mitigate environmental impacts.