Liquid Cooling Solutions
for the next frontier of AI

Unparalleled cooling performance for the modern data center

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As AI and HPC workloads push compute density and power to new limits, traditional air-cooling struggles to keep up. ASUS liquid cooling efficiently removes heat from high-performance CPUs, GPUs, and accelerator-dense racks, reducing energy use, lowering PUE, and supporting higher rack density.
Engineered for total flexibility, ASUS provides fully liquid, hybrid, or retrofitted configurations that integrate seamlessly into existing data centers. This versatile approach ensures peak reliability and scalability, helping enterprises optimize both performance and Total Cost of Ownership (TCO) for large-scale AI deployments.

Partner and Ecosystem

ASUS collaborates with a strong ecosystem of partners to ensure our liquid cooling solutions are purpose-built for the most demanding AI and HPC workloads, delivering optimal thermal efficiency, system stability, and performance at scale.
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Top reasons to choose liquid cooling

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Performance Density

Exceeds the 30kW-per-rack limit of air cooling, maximizing computational power per square foot to accelerate complex AI workloads.
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Enhanced PUE

Dramatically improves PUE by replacing power-hungry fans and CRAC systems with high-efficiency liquid heat exchange.
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Strategic ROI & OpEx

Achieves faster ROI through heat recirculation; initial migration costs are often recovered within 12 months via significantly lower utility bills.
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Acoustic Environment

Lowers noise levels from 95 dBA to below 75 dBA, creating a healthier, quieter workspace for enterprise and defense data centers.

Beyond Air Cooling
Liquid Cooling for Demanding AI/HPC Infrastructure

Scaling AI/HPC infrastructure requires a strategic shift to liquid cooling to master high-kW heat removal and sustain full-capacity workloads. By optimizing migration costs and 1-3 years operational expenses, this transition delivers a superior ROI while maximizing performance density per square foot for next-generation computing.

ASUS Optimized Liquid Cooling Solutions

ASUS Optimized Liquid-Cooling Solutions offer a comprehensive portfolio spanning direct-to-chip (D2C), in-row CDU–based cooling, and hybrid configurations, enabled through collaboration with global infrastructure leaders.

Direct-to-Chip Cooling (D2C)

Directly cools CPUs/GPUs to boost performance, extend hardware lifespan, and slash energy consumption.

Direct-to-Chip Cooling
with In-Row CDU

Combines precision chip-level cooling with centralized row control to maximize thermal efficiency and simplify large-scale AI deployment.

Liquid-to-Air Cooling

Absorbs system heat via liquid and dissipates it through air, providing a flexible upgrade compatible with existing infrastructure.
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FAQ

  • 1. What is ASUS Liquid Cooling?
    1. What is ASUS Liquid Cooling? ASUS Liquid Cooling solutions use direct liquid cooling and immersion cooling technologies to efficiently remove heat from servers. Compared to traditional air cooling, they support higher-density computing while significantly improving power usage effectiveness (PUE), reducing data center energy consumption, and lowering operational costs.