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CPU

Intel® Socket 1151for 8th Generation Core™ i7/Core™ i5/Core™ i3/Pentium®/Celeron® Processors,Supports Intel® Turbo Boost Technology 2.0,* The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.,Supports Intel® 14nm CPU,* Refer to www.asus.com for CPU support list
Build in Intel® Socket 2066 Core™ X-Series Processors,* Refer to www.asus.com for CPU support list

Chipset

Intel® H310
Build in Intel® X299

Memoria

2 x DIMM, Max. 32GB, DDR4 2666/2400/2133 MHz Non-ECC, Un-buffered Memory,* The maximum memory frequency supported varies by processor,** DDR4 2666MHz and higher memory modules will run at max. 2666MHz on Intel® 8th Gen. 6-core or higher processors.,Supports Intel® Extreme Memory Profile (XMP),Dual Channel Memory Architecture,* Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists).
8 x DIMM, Max. 128GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory,4 x DIMM, Max. 64GB, DDR4 4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400 MHz Non-ECC, Un-buffered Memory,* Please refer to ASUS AVL for the latest update.,Intel® Core™ X-series Processors (4-core),* Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.,Intel® Core™ X-series Processors (6-core above),* Hyper DIMM support is subject to the physical characteristics of individual CPUs.

Grafica

Multi-VGA output support : HDMI/DVI-D/D-Sub ports,- Supports HDMI 1.4b with max. resolution 4096 x 2160 @ 24 Hz / 25600 x 1600 @ 60 Hz,- Supports D-sub with max. resolution 1920 x 1200 @ 60 Hz,Integrated Graphics Processor- Intel® HD Graphics support,Maximum shared memory of 1024 MB (for iGPU exclusively),Supports Intel® InTru™ 3D, Quick Sync Video, Clear Video HD Technology, Insider™,- Supports DVI-D with max. resolution 1920 x 1200 @ 60Hz

Supporto Multi-GPU

Supports NVIDIA® 3-Way SLI™ Technology *,Supports AMD 3-Way CrossFireX™ Technology *

Slot di Espansione

1 x PCIe 3.0/2.0 x16 (x16 mode)
1 x PCIe 3.0 x16 (x4 mode),16-Lane CPU-,2 x PCIe 3.0 x16 (x4 mode),2 x PCIe 3.0 x16 (x16 mode),1 x PCIe 3.0 x4 (x4 mode),44-Lane CPU-,28-Lane CPU-,1 x PCIe 3.0 x16 (x16 mode),1 x PCIe 3.0 x16 (x8 mode)

Storage

1 x M.2 Socket 3, , with M Key, type 2260/2280 storage devices support (both SATA & PCIE mode)*1,Intel® H310 Chipset : ,4 x SATA 6Gb/s port(s), gray,
1 x M.2 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode)*1,Support Intel® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID,Supports Intel® Smart Response Technology,Intel® Rapid Storage Technology 15 support,1 x M.2 Socket 3, with M key, type 2242/2260/2280 storage devices support (both SATA & PCIE mode)*2,Intel® X299 Chipset : ,Support Raid 0, 1, 5, 10,Intel® Optane™ Memory Ready,6 x SATA 6Gb/s port(s)

LAN

Realtek® RTL8111H, 1 x Gigabit LAN
Intel® I210-AT, 2 x Gigabit LAN Controller(s)

Audio

Realtek® ALC8878-Channel High Definition Audio CODEC,- Supports : Jack-detection, Front Panel Jack-retasking,Audio Feature :,- Audio Shielding: Ensures precision analog/digital separation and greatly reduced multi-lateral interference,- Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals,- Premium Japanese audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity,* Choose the chassis with HD audio module in front panel to support 8-channel audio output.
Realtek® ALC S1220A7.1-Channel High Definition Audio CODEC featuring Crystal Sound 3,- Audio amplifier: Provides the highest-quality sound for headphone and speakers,- High quality120dBSNR stereo playback output(Line-out at rear)and113dB(Line-in),- Supports : Jack-detection, Multi-streaming, Front Panel MIC Jack-retasking,- DTS Connect,- DTS Headphone:X,- Internal audio Amplifier to enhance the highest quality sound for headphone and speakers,- Impedance sense for front and rear headphone outputs,Audio Feature :,- Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity,- Unique de-pop circuit: Reduces start-up popping noise to audio outputs,Separate layer for left and right track, ensuring both sound deliver equal quality

Porte USB

4 x USB 2.0/1.1 port(s) (2 at back panel, , 2 at mid-board),Intel® H310 Chipset :,4 x USB 3.1 Gen 1 up to 5Gbps port(s) (2 at back panel, blue, Type-A, 2 at mid-board)
3 x USB 3.1 Gen 2 port(s) (2 at back panel, , Type-A + USB Type-CTM, 1 at mid-board),6 x USB 2.0 port(s) (4 at back panel, , 2 at mid-board),6 x USB 3.1 Gen 1 port(s) (4 at back panel, , 2 at mid-board),Intel® X299 Chipset :,ASMedia® USB 3.1 Gen 2 controller :

Caratteristiche Speciali

- ASUS DIGI+ VRM: 5 Phase digital power design,M.2 Onboard(The latest transfer technologies with up to 20 Gb/s data transfer speeds),- ASUS Fan Xpert 2+,- File Transfer,- Stylish Fanless Design Heat-sink solution,ASUS 5X Protection III :
- ASUS SafeSlot Core: Fortified PCIe Slot prevents damage,- ASUS LANGuard: Protects against LAN surges, lightning strikes and static-electricity discharges!,- ASUS Overvoltage Protection: World-class circuit-protecting power design,- ASUS Stainless-Steel Back I/O: 3X corrosion-resistance for greater durability!,ASUS EPU :,- EPU,ASUS Exclusive Features :,- AI Suite 3,- Ai Charger,ASUS Quiet Thermal Solution :,ASUS EZ DIY :,- ASUS CrashFree BIOS 3,- ASUS EZ Flash 3,- ASUS UEFI BIOS EZ Mode,ASUS Q-Design :,- ASUS Q-DIMM
ASUS 5X Protection :,- ASUS Stainless Steel Back I/O - 3x more durable corrosion-resistant coating,- Industry leading Digital 8 Phase CPU Power Design,- Ai Charger+,Asus Control Center (ACC) IT management software supported,ASUS Digital Power Design :,- Industry leading Digital 2 Phase DRAM Power Design,- Crystal Sound 3,M.2 and U.2 Onboard (The Latest Transfer Technology with up to 32Gb/s Data-transfer Speeds for M.2 and U.2),- Stylish Fanless Design with M.2 Heat-sink solution,OC Design - ASUS PRO Clock II Technology,- Aura Addressable Strip Header(s),- ASUS Q-Connector,- ASUS Q-Code,AURA :,- Aura RGB Strip Headers,- ASUS Enhanced DRAM Overcurrent Protection - Short circuit damage prevention,- ASUS ESD Guards - Enhanced ESD protection,ASUS EPU :,- EPU,ASUS Exclusive Features :,- Turbo LAN,ASUS Quiet Thermal Solution :,ASUS Q-Design :,- ASUS Q-Shield,- ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED),- ASUS Q-Slot,- ASUS Q-DIMM

Porte I/O Posteriori

2 x USB 3.1 Gen 1 (blue) Type-A up to 5Gbps,1 x D-Sub,1 x DVI-D,2 x USB 2.0,3 x Audio jack(s),1 x PS/2 keyboard/mouse combo port(s),1 x LAN (RJ45) port(s),1 x HDMI
2 x USB 3.1 Gen 2 ()Type-A + USB Type-CTM,4 x USB 2.0,4 x USB 3.1 Gen 1 ,,1 x 8-channel Audio I/O,1 x USB BIOS Flashback Button(s),2 x LAN (RJ45) port(s),1 x Optical S/PDIF out

I/O Interne

1 x M.2 Socket 1 with E key, type 2230 for Wi-Fi/BT devices support or PCIE/USB mode,1 x M.2 Socket 3 with M key, type 2260/2280 storage devices support (SATA & PCIE x4 mode),1 x Chassis Intrusion connector(s),1 x USB 3.1 Gen 1(up to 5Gbps) connector(s) support(s) additional 2 USB 3.1 Gen 1 port(s) (19-pin),1 x USB 2.0 connector(s) support(s) additional 2 USB 2.0 port(s),2 x Chassis Fan connector(s) (2 x 4-pin),1 x 14-1 pin TPM connector,1 x Speaker connector,1 x System panel connector,1 x COM port(s) connector(s),4 x SATA 6Gb/s connector(s),1 x CPU Fan connector(s) (1 x 4-pin),1 x S/PDIF out header(s),1 x 24-pin EATX Power connector(s),1 x 4-pin ATX 12V Power connector(s),1 x Front panel audio connector(s) (AAFP),1 x Clear CMOS jumper(s)
1 x VGA connector(s),1 x AUX panel header(s),1 x PANEL2,1 x PANEL1,1 x Front fan,1 x Rear fan,1 x PUMP Fan connector,1 x 6-pin ATX Power connector,2 x 8-pin ATX 12V Power connector(s),1 x EZ XMP switch,1 x MemOK! Button,1 x CPU_OV jumper,1 x USB 3.1 Gen 1(up to 5Gbps) connector(s) support(s) additional 2 USB 3.1 Gen 1 port(s),1 x Aura RGB Strip Header,1 x AIO PUMP Header,1 x 5-pin EXT_FAN(Extension Fan) connector,1 x USB 2.0 connector(s) support(s) additional 2 USB 2.0 port(s),1 x Aura Addressable Strip Header(s),1 x M.2 Socket 3 with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode),1 x VROC_HW_Key,1 x Thunderbolt header(s),1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (SATA mode & X4 PCIE mode),6 x SATA 6Gb/s connector(s),1 x Power-on button(s),1 x Reset button(s),1 x Thermal sensor connector,1 x COM port(s) connector(s),1 x 24-pin EATX Power connector(s),1 x U.2 Connector (support U.2 NVMe device)

Accessori

2 x M.2 Screw Package,2 x SATA 6Gb/s cable(s),User´s manual,I/O Shield,1 x Supporting DVD
1 x SLI bridge(s),1 x 2-port USB module(s),2 x M.2 screws,1 x COM port cable(s),1 x 3-Way SLI bridge(s),1 x Vertical M.2 bracket set,6 x SATA 6Gb/s cable(s),1 x Q-Connector,1 x Extension Cable for RGB strips (80 cm),User´s manual,I/O Shield,1 x Supporting DVD

BIOS

128 Mb Flash ROM, UEFI AMI BIOS, PnP, SM BIOS 3.1, ACPI 6.1, Multi-language BIOS, ASUS EZ Flash 3, CrashFree BIOS 3, F6 Qfan Control, F3 My Favorites, Last Modified log, F12 PrintScreen, and ASUS DRAM SPD (Serial Presence Detect) memory information

Peso

Gift Box(3-in-1)
Net Weight: 4.59 Kg
Gross Weight: 7.48 Kg

Bulk Pack(5-in-1)
Net Weight: 7.15 Kg
Gross Weight: 8.94 Kg

Gestibilità

WOL by PME, PXE

Note

*1 When a device in SATA mode is installed on the M.2 socket, SATA_2 port cannot be used.
Due to the Chipset limitation, when a M.2 device is installed in PCIe mode, the socket is set
to PCIe 2.0.
*Actual number of Multi-graphic supported differs per Vendors´ Graphic cards. Please check with Vendor beforehand.
*1 Bandwidth is shared between M.2_2 and U.2
*2 SATA Bandwidth is shared between M.2_1 and SAT6G_1

Sistema Operativo

Windows® 10 64-bit

Dimensioni Scheda

6.7 inch x 6.7 inch ( 17 cm x 17 cm ),Mini ITX Form Factor
  • Questo tipo di prodotto (comprese le parti elettriche, l\^dequipaggiamento elettronico, le celle delle batterie e le parti contenenti Mercurio) non dovrebbe essere gettato nella spazzatura comune. Vi preghiamo di controllare le disposizioni di legge locali in merito allo smaltimento dei rifiuti elettrici od elettronici.

  • Questo tipo di prodotto (comprese le parti elettriche, l'equipaggiamento elettronico, le celle delle batterie e le parti contenenti Mercurio) non dovrebbe essere gettato nella spazzatura comune. Vi preghiamo di controllare le disposizioni di legge locali in merito allo smaltimento dei rifiuti elettrici od elettronici.