No matter which ROG X570 motherboard you choose, we want to ensure you can take advantage of the powerful AMD 3rd Gen Ryzen processors, check below to find out how and test yourself with the ROG Crossword Challenge.

POWERFUL PERFORMACE

COOLING INNOVATION

HEATSINK DESIGN

  1. MOS Heatsink with 8mm Heatpipe

    A MOS heatsink provides a large contact area for the MOSFETs and chokes, and a heatpipe enables more efficient cooling of the west and north MOS heatsink for better performance and wattage resistance.

  2. Thermal Pad

    A high-quality thermal pad helps transfer heat from the inductor and phase array to the heatsink.

  3. Dual M.2 Heatsinks

    The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability.

  4. Active Chipset Heatsink Solution

    PCIe 4.0 provides twice the bandwidth for data flowing through the chipset, which creates more heat than the previous generation. The ROG X570 motherboards feature an actively cooled heatsink to prevent throttling during sustained transfers.

- Custom Delta Superflo Fan

The custom low-noise fan features a high-durability bearing with a 60,000-hour L10* lifespan.

* L10 bearing lifespan specifies the minimum number of hours that 90% of the bearing are expected to last.

- Air Duct

A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.

- Finned Heatsink

The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.

NEXT-GEN CONNECTIVITY

DIY FRIENDLY

  • FLEXKEY

    At its default, the FlexKey functions as a system reset button, but it can also be easily set to quickly turn Aura lighting on or off, activate Safe Boot or enter the BIOS.​
    *Only on selected model

  • BIOS FLASHBACK™

    Simply drop the (UEFI) BIOS file onto a FAT32 formatted USB stick, plug it into the USB BIOS Flashback port and press the button. Updates can even be performed without having memory or a CPU installed.

  • ROG PATENTED
    PRE-MOUNTED I/O SHIELD

    ROG's patented I/O shield is finished in sleek matte black, and it’s pre-mounted to make it easy to install the motherboard.

  • ASUS NODE CONNECTOR

    ASUS Node is a proprietary bi-directional interface that allow ASUS motherboards to communicate with other system components, opening up a wealth of new options for system builders.​

SPECIFICATIONS

* The specifications depend on different CPU types. The listed specifications are based on 3rd Gen AMD Ryzen™ Processors.
Model Name ROG Strix X570-E Gaming ROG Strix X570-F Gaming ROG Strix X570-I Gaming
CPU AMD AM4 Socket for 3rd and 2nd Gen AMD Ryzen™/2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
Chipset AMD X570 Chipset
Form Factor ATX (12 x 9.6 in.) ATX (12 x 9.6 in.) Mini-ITX (6.7 x 6.7 in.)
Memory 4 DDR4/ 128 GB 4 DDR4/ 128 GB 2 x DDR4 / 64 GB
Graphics Output HDMI 2.0 / DP 1.2 HDMI 2.0 / DP 1.2 HDMI 2.0 / DP 1.4
Multi-GPU Support 2-way SLI® & 3-way CFX 2-way SLI® & 3-way CFX N/A
Expansion slots PCIe 4.0 x 16 2 @ x16 or x8/x8 2 @ x16 or x8/x8 1 @ x16
PCIe 4.0 x 16 1 max@ x4 1 max@ x4 N/A
PCIe 4.0 x 1 2 2 N/A
Storage & Connectivity SATA 6Gb/s 8 8 4
U.2 0 0 0
M.2 1x 22110 (SATA + PCIe 4.0 x4) 1x 22110 (SATA + PCIe 4.0 x4) 1 x 2280 (SATA + PCIe 4.0 x4)
1x 22110 (SATA + PCIe 4.0 x4) 1x 22110 (SATA + PCIe 4.0 x4) 1 x 2280 (SATA + PCIe 4.0 x4)
USB 3.2 Gen 2 front panel connector 1 1 0
USB 3.2 Gen 2 7 x Type-A at back
1 x Type-C at back
3 x Type-A at back
1 x Type-C at back
3 x Type-A at back
1 x Type-C at back
USB 3.2 Gen 1 4 x Type-A at back
2 x Type-A at front
4 x Type-A at back
2 x Type-A at front
4 x Type-A at back
2 x Type-A at front
USB 2.0 4 4 2
Networking Gigabit Ethernet Realtek® 2.5G LAN
Intel® I211AT
Intel® I211AT Intel® I211AT
Wireless Intel® Wireless-AX200 2 x 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) with MU-MIMO supports dual frequency band 2.4/5GHz N/A Intel® Wireless-AX 200 2 x 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) with MU-MIMO supports dual frequency band 2.4/5GHz
Bluetooth Bluetooth v5.0 N/A Bluetooth® 5.0
Audio Codec SupremeFX S1220A SupremeFX S1220A SupremeFX S1220A
Effects Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Aura Aura Sync V V V
4-pin RGB Header 2 2 1
Addressable Gen 2 RGB Header 2 2 1
Pre-mounted I/O Shield V V N/A
Safeslot V V V
M.2 Cooling Solution M.2 heatsink M.2 heatsink M.2 Audio Combo Card SafeSlot

SPECIFICATIONS

* The specifications depend on different CPU types. The listed specifications are based on 3rd Gen AMD Ryzen™ Processors.
Model Name ROG Crosshair VIII Formula ROG Crosshair VIII Hero (WI-FI) ROG Crosshair VIII Hero ROG Crosshair VIII Impact
CPU AMD AM4 Socket for 3rd and 2nd Gen AMD Ryzen™/2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
Chipset AMD X570 Chipset
Form Factor ATX (12 x 9.6 in.) ATX (12 x 9.6 in.) ATX (12 x 9.6 in.) Mini-DTX (8.0" x 6.7" in.)
Memory 4 DDR4/ 128 GB 4 DDR4/ 128 GB 4 DDR4/ 128 GB 2 x DDR4 / 64 GB
Graphics Output N/A N/A N/A N/A
Multi-GPU Support 2-way SLI® & 3-way CFX 2-way SLI® & 3-way CFX 2-way SLI® & 3-way CFX N/A
Expansion slots PCIe 4.0 x 16 2 @ x16 or x8/x8 2 @ x16 or x8/x8 2 @ x16 or x8/x8 1 @ x16
PCIe 4.0 x 16 1 @ x4 1 @ x4 1 @ x4 N/A
PCIe 4.0 x 1 1 1 1 N/A
Storage & Connectivity SATA 6Gb/s 8 8 8 4
U.2 0 0 0 0
M.2 1x 22110 (SATA + PCIe 4.0 x4) 1x 22110 (SATA + PCIe 4.0 x4) 1x 22110 (SATA + PCIe 4.0 x4) 1x 2280 (SATA + PCIe 4.0 x4)
1x 2280 (SATA + PCIe 4.0 x4) 1x 2280 (SATA + PCIe 4.0 x4) 1x 2280 (SATA + PCIe 4.0 x4) 1 x 2280 (SATA + PCIe 4.0 x4)
USB 3.2 Gen 2 front panel connector 1 1 1 1
USB 3.2 Gen 2 7 x Type-A at back
1 x Type-C at back
7 x Type-A at back
1 x Type-C at back
7 x Type-A at back
1 x Type-C at back
5 x Type-A at back
1 x Type-C at back
USB 3.2 Gen 1 4 x Type-A at back
4 x Type-A at front
4 x Type-A at back
2 x Type-A at front
4 x Type-A at back
2 x Type-A at front
2 x Type-A at back
2 x Type-A at front
USB 2.0 4 4 4 2
Networking Gigabit Ethernet Aquantia® 5G LAN
Intel® I211AT
Realtek® 2.5G LAN
Intel® I211AT
Realtek® 2.5G LAN
Intel® I211AT
Intel® I211AT
Wireless Intel® Wireless-AX200 2 x 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) with MU-MIMO supports dual frequency band 2.4/5GHz Intel® Wireless-AX200 2 x 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) with MU-MIMO supports dual frequency band 2.4/5GHz N/A Intel® Wireless-AX 2002 x 2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax) with MU-MIMO supports dual frequency band 2.4/5GHz
Bluetooth Bluetooth v5.0 Bluetooth v5.0 N/A Bluetooth® 5.0
Audio Codec SupremeFX S1220 SupremeFX S1220 SupremeFX S1220 SupremeFX S1220
Effects Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Sonic Studio III
Sonic Studio Virtual Mixer
Sonic Radar III
DTS® Sound Unbound
Aura Aura Sync V V V V
4-pin RGB Header 2 2 2 1
Addressable Gen 2 RGB Header 2 2 2 2
Pre-mounted I/O Shield V V V V
Safeslot V V V V
M.2 Cooling Solution M.2 heatsink M.2 heatsink M.2 heatsink SO-DIMM.2 with heatsink

ROG Crossword Challenge

HOW TO PARTICIPATE

Between Nov 15 to Dec 5, 2019, simply follow:

1. Crossword

Complete the crossword below and obtain a hidden message.

2. Enter

Enter the hidden message within Gleam and complete additional missions to amplify your chance of winning.

reminder

Across

  • 2. Using the 3-Pin _____ header on the ROG Motherboards, users can control and design all 144 ______ LEDs on the front panel of the InWin 309.
  • 5. Immersive yourself in sound with ROG _______ audio technology , which is engineered to provide a flat frequency response and offer a neutral, detailed sound signature.
  • 7. Take RGB lighting beyond the checkbox, combining and controlling the LEDs across all of your ROG products with this software.
  • 9. This technology allows memory kits to run at lower latencies, reduced voltages, and operate at higher frequencies.
  • 10. Optimized for the latest AMD Ryzen 3000 series processors and X570 motherboards, G.SKILL Trident Z ___ series DDR4 memory brings extreme memory performance to any gaming PC or workstation.

down

  • 1. USB _______ has become the simplest and most fail-safe method of (UEFI) BIOS updating possible. Simply drop the (UEFI) BIOS file onto a FAT32 formatted USB stick, plug it into the USB _______ port and press the Flashback button next to it.
  • 2. Featuring an array of 16 strategically ___ED_____, the Crosshair VIII Formula's VRM is geared for any workload and all operating conditions.
  • 3. ROG Strix’s motherboard is imprinted with Futuristic ______ patterns provide an additional stylish accent, rounding out a design that proudly proclaims the board's gaming identity.
  • 5. Designed and engineered in cooperation with the EK team, the new _____ EK III hybrid cooling block offers air or liquid cooling.
  • 8. This form factor is marginally taller than mini-ITX allowing the Crosshair VIII Impact to squeeze in features while still fitting a large proportion of mini-ITX PC cases.
  • 11. Functions as a system reset button, but it can also be easily set to quickly turn Aura lighting on or off, activate Safe Boot or enter the BIOS.​
  • 12. The A1 Plus is a Mini-ITX chassis and is equipped with a _______ charger on the top to charge all Qi enabled devices.
  • 14. Crosshair VIII _____ Mini-DTX frame packs loads of ATX-grade features, including advanced power delivery and cooling.

Hidden Message

    JOIN HERE