ASUS Z590 series motherboards are designed to extract every ounce of performance from the latest 11th Gen Intel® Core™️ processors. Updated power designs underpin the entire lineup, which is further enhanced with the latest connectivity options and boosted by slick features that leverage Artificial Intelligence to put advanced performance at your fingertips.

AI Motherboards

ASUS Z590 motherboards feature exclusive software and firmware utilities that leverage machine learning and Artificial Intelligence (AI) to improve the user experience. On select motherboard models, the latest ASUS AI enhancements span four distinct pillars of performance, including overclocking, cooling, networking and even onboard audio, making advanced tweaks and optimization more accessible to both new recruits and savvy PC DIY veterans.

  • AI Overclocking
  • AI Cooling
  • AI Networking

Two-way AI Noise Cancelation

Our latest audio utility leverages a massive deep-learning database to reduce background noise from the microphone* and incoming audio. Distracting keyboard clatter, mouse clicks and other ambient noises are smartly pared back so you can hear and be heard with crystal clarity while gaming or in calls.

*An audio splitter (3.5 mm audio jack Y-cable) is necessary when using a 3.5 mm headset.
  • 500M

    Deep-Learning
    Database

  • Audio

    Input/output

  • High

    Fidelity

  • Minimal

    Performance Impact


Hear the difference

AI OFF
AI ON
mic sound
  • TALKING


  • HEARING

    without noise

    ASUS Motherboard User
  • HEARING

    without noise

  • TALKING


    Other Party
  • Background noise
  • Other human voice
  • Human speech

ROBUST POWER & COOLING

  1. Teamed power stages

    ASUS Z590 motherboards utilize teamed power-stages and high-quality components to fuel the latest 11th Gen Intel Rocket Lake CPUs. Even at entry level, the power solutions are geared to deliver sustained performance, and through the lineup those credentials are strategically scaled up to push boundaries and set new standards.

    Learn More about ASUS Teamed Power Design
  2. Cooler by design

    To ensure system stability under heavy CPU loads, ASUS Z590 motherboards employ large VRM and chipset heatsinks that strike the right balance between surface area and mass. That same philosophy also extends to onboard M.2 heatsinks, ensuring readiness for the next wave of PCIe 4.0 SSDs.

Next-gen connectivity

  • Thunderbolt 4

    ASUS Z590 motherboards offer up to two onboard Thunderbolt 4 USB-C® ports, each providing up to 40 Gbps of bidirectional bandwidth for the latest high-speed devices and drives.

  • PCIe 4.0 Ready

    Designed specifically for 11th Gen Intel Core CPUs, ASUS Z590 motherboards are fully validated to support PCIE 4.0 and ready for the latest GPUs and high-speed SSDs.

  • Intel Ethernet

    Ready for the latest high-performance routers, Intel 2.5G Ethernet provides up to a 2.5X improvement over standard Ethernet connections, delivering blazing file transfers, smoother lag-free gaming and high-res video streaming.

Next-gen connectivity
WiFi 6E (802.11 ax)

WiFi 6E (802.11 ax)

The ROG Z590 series features WiFi 6E technology, which takes advantage of the newly available radio spectrum in the 6 GHz band. WiFi 6E has triple the bandwidth of the 5 GHz band and up to seven 160 MHz frequency bands to deliver ultrafast wireless-networking speeds, improved capacity and better performance in dense wireless environments.



*WiFi 6E availability and features are dependent on regulatory limitations and co-existence with 5 GHz WiFi.
To learn more about the ASUS WiFi 6E ecosystem, please visit: asus.com/content/WiFi6/#WIFI-6E
M.2 Q-Latch

M.2 Q-Latch

The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.

ROG Maximus XIII Extreme Glacial

ROG Maximus XIII Extreme Glacial

  • EATX

  • 18+2 power stages

  • Integrated EK water block

  • Five M.2 heatsinks and embedded backplates

  • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

  • Marvell® 10 Gb, Intel® 2.5 Gb Ethernet, Intel WiFi 6E

  • PCIe® 4.0 ready*, onboard Thunderbolt™ 4 Type-C® port

ROG Maximus XIII Extreme

ROG Maximus XIII Extreme

  • EATX

  • 18+2 power stages

  • OptiMem III

  • Five M.2 heatsinks and embedded backplates

  • PCIe® 4.0 ready*, onboard Thunderbolt™ 4 Type-C® port

  • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

  • Marvell® 10 Gb, Intel® 2.5 Gb Ethernet, Intel WiFi 6E

ROG Maximus XIII Hero

ROG Maximus XIII Hero

  • ATX

  • 14+2 power stages

  • OptiMem III

  • Four M.2 with heatsinks and embedded backplates

  • PCIe® 4.0 ready*, onboard Thunderbolt™ 4 Type-C® port

  • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

  • Intel® WiFi 6E, dual Intel® 2.5 Gb Ethernet

ROG Strix Z590-E Gaming WIFI

ROG Strix Z590-E Gaming WIFI

  • ATX

  • 14+2 power stages

  • OptiMem III

  • Four M.2 with heatsinks and an embedded backplate for PCIe 4.0 M.2 slot

  • PCIe® 4.0 ready*, Thunderbolt™ header

  • AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation

  • Intel® WiFi 6E, dual Intel®2.5 Gb Ethernet

TUF Gaming Z590 Plus WIFI

TUF Gaming Z590 Plus WIFI

  • ATX

  • 14+2 DrMOS power stages

  • OptiMem II

  • Enlarged VRM and two M.2 heatsinks

  • Intel® WiFi6 (AX201), Intel 2.5Gb Ethernet

  • PCIe® 4.0 ready*, USB 3.2 Gen 2x2 Type-C®, Thunderbolt™ 4 header, Three M.2 slots

  • Two-Way AI Noise Cancelation

Prime Z590-A

Prime Z590-A

  • ATX

  • 14+2 DrMOS power stages

  • OptiMem II

  • VRM and two M.2 heatsinks

  • Intel® 2.5 Gb Ethernet

  • PCIe® 4.0 ready*, USB 3.2 Gen 2x2 Type-C®, Thunderbolt™ 4 header, Three M.2 slots

  • AI Overclocking, AI Cooling, and Two-Way AI Noise Cancelation



*Listed specifications are based on 11th Gen Intel® Core™ processors. Specifications may vary based on CPU used.