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AISSENS 100AW- 6KHz high resolution vibration sensor, 2.4GHz Wi-Fi/BLE connectivity, IP68, wide temperature measurement, full scale raw data, feature data, OA, FFT.
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R680E ATX Motherboard, High-Computing Power, MIL-STD 810H DIMM Lock and PCIe Holder, ASUS IoT's Dedicated WDT 2.0, Integrated I/O, Dedicated Heatsink, Wide Operating Temperature, Out-of-Band

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The ASUS EBS-4U500 product series includes both barebone and system options, utilizing a standard 19-inch 4U rackmount chassis in black or gray-white. The chassis supports ATX, Micro-ATX, and Mini-ITX motherboards equipped with Intel® H610, Q670E, or R680E chipsets, and provides up to seven full-height PCI/PCIe expansion slots. The upgraded new chassis is easier to assemble, more robust, and features reserved mounting positions for two 6025 fans. Additionally, it is compatible with standard ATX power supplies, with power ratings ranging from 300W to 1300W, or mini-redundant 500W PSU.

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Supports MXM 3.1 Type A and Type B GPU modules for the early-stage development and rapid validation of embedded GPU applications
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The ASUS EBS-4UG product series includes both barebone and system options, utilizing a standard 19-inch 4U rackmount chassis in gray-white. The chassis supports ATX, Micro-ATX, and Mini-ITX motherboards equipped with Intel® H110, H310, H610, Q170, Q470E, Q670E, or R670E chipsets, and provides up to seven full-height PCI/PCIe expansion slots. Additionally, it is compatible with standard ATX power supplies, with power ratings ranging from 300W to 1300W.

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The ASUS EBS-4U product series includes both barebone and system options, utilizing a standard 19-inch 4U rackmount chassis in black. The chassis supports ATX, Micro-ATX, and Mini-ITX motherboards equipped with Intel® H110, H310, H610, Q170, Q470E, Q670E, or R670E chipsets, and provides up to seven full-height PCI/PCIe expansion slots. Additionally, it is compatible with standard ATX power supplies, with power ratings ranging from 300W to 1300W.

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Rugged edge AI computer supporting NVIDIA® or Intel® MXM GPU and 13th Gen Intel® Core™ processor

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Intel® Celeron® Quad Core J6412 SoC, 2 x So-DIMM, 1 x DP++, 1 x HDMI, 1 x VGA, 2 x LAN, 2 x 2.5‘’ SATA, 4 x USB 3.1 Gen 1, 4 x USB 2.0, 6 x COM, 1 x Power button, 1 x SSD active LED, 1 x Power LED, 1 x System LED, 1 x Reset Switch, 1 x Remote button

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Advanced IQC inspection equipment for incoming SMD materials, for color spots, marking codes and verifying dimensions.
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Standard 19-inch rackmount 4U chassis, made of sturdy and durable 1.2mm SGCC sheet metal, compatibility with AT, micro ITX motherboards, including Intel® Q470, H610, or Q670E chipsets, and equipped with a 500W, 850W or 1300W power supply, enhance security, compatibility, and adaptability.

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Intel® J6412, Mini-ITX Motherboard, 2*DDR4 up to 32GB, 4*USB 3.2 Gen1, 4*USB 2.0, 1*VGA, 1*HDMI, 1*DP, 1*COM

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Rugged fanless computer with Intel® Atom® x7000RE-series processors, DDR5 4800MHz, DisplayPort, HDMI, dual-LAN, up to six COM and USB ports, 9-36V DC-in, plus wide voltage range and temperature support.

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NVIDIA Jetson™ AGX Orin™, Intelligent Edge AI System, Arm-based, Up to 275 TOPS, Dual LAN, Quad POE LAN, M.2 E, M.2 M, M.2 B, 9 to 36V, -25 to 55 °C

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NVIDIA Jetson™ AGX Orin™, Intelligent Edge AI System, Arm-based, Up to 275 TOPS, Dual LAN, Quad POE LAN, M.2 E, M.2 M, M.2 B, 9 to 36V, -25 to 70 °C

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Intel® Atom X7000RE Series Embedded Fanless Computer with DDR5, 4K@60hz via DP and HDMI, Dual-LAN, Multiple COM, M.2 E key, M.2 B key, M.2 M key, 9-36V DC

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Arm System, Rockchip RK3566, LPDDR4X, eMMC, USB3, USB2, MIPI-DSI, HDMI, M.2 E, 12-19V
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Arm System, Rockchip RK3566, LPDDR4X, USB3, USB2, MIPI-DSI, HDMI, M.2 E, 12-19V
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3.5” SBC, Intel® Atom® X7835RE, Amston Lake, DDR5 SO-DIMM, 5G/LTE/WiFi, DP, HDMI, eDP/LVDS, Dual-LAN, Multiple COM, USB3.2, M.2, SATA 3.0, PCIE 3.0, TPM

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3.5” SBC, Intel® Atom® X7433RE, Amston Lake, DDR5 SO-DIMM, 5G/LTE/WiFi, DP, HDMI, eDP/LVDS, Dual-LAN, Multiple COM, USB3.2, M.2, SATA 3.0, PCIE 3.0, TPM

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3.5” SBC, Intel® Atom® X7213RE, Amston Lake, DDR5 SO-DIMM, 5G/LTE/WiFi, DP, HDMI, eDP/LVDS, Dual-LAN, Multiple COM, USB3.2, M.2, SATA 3.0, PCIE 3.0, TPM

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¹The Windows 11 upgrade will be delivered to qualifying devices late 2021 into 2022. Timing varies by device. Certain features require specific hardware (see aka.ms/windows11-spec).