Intel 2U4N high-density server with each node supporting up to dual-socket CPUs, one PCIe 4.0, 16 DIMM, two NVMe, two M.2 and one OCP3.0
  • Powered by dual-socket 3rd Gen Intel Scalable processors and 16 3200 MHz DIMM per node
  • One PCIe 4.0 x16 slot per node enables higher networking bandwidth and improved data-transfer rates
  • One OCP 3.0 module per node delivers the speeds of up to 200 Gbps for data-center applications
  • A total of eight front-panel storage bays for a combination of NVMe, SATA and SAS drives to enable extensive storage and high-throughput performance
  • Onboard Broadcom® 3008 SAS 12 Gbps controller for RAID or SAS drive
  • High power-efficiency with redundant 3000 W 80 Plus® Titanium power supplies
  • Flexible air- and liquid-cooling solution to achieve lower power-usage effectiveness (PUE) and optimized TCO for data centers
  • Onboard ASUS ASMB10-iKVM for out-of-band management with ASPEED AST2600 controller
OP product mainImage

Transform your data center TCO with the high-density server powered by 3rd Gen Intel® Xeon® Scalable processors. With an innovative design that fits four nodes in a 2U chassis, RS720Q-E10-RS8U accommodates dual-socket CPUs, PCIe 4.0 and OCP 3.0 expansions to satisfy the increasing demands for efficiency, density and TCO-optimization for data centers, web servers, virtualization, cloud and hyperscale environments.


High CPU

2 sockets

PCIe 4.0

1 slot

DDR4 3200


NVMe Drive

2 bays

M.2 Storage

2 slots

System Cooling


3rd Gen Intel® Xeon® Scalable Processors

The latest 3rd Gen Intel® Xeon® Scalable Processors feature core counts from 8 to 40 cores and an array of frequency and power supports, and deliver up to 40% better performance compared to the previous generations. With built-in security features, this new platform delivers outstanding performance in security including encryption, authentication and data integrity across the breadth of standards that are prevalent in networking, enterprise and the cloud.

Up to


General compute
performance gain

Up to


PCI Express 4 (per socket)



Up to 1.42X more cores

3<sup>rd</sup> Gen Intel<sup>®</sup> Xeon<sup>®</sup> Scalable Processors
Product Layout Overview
Front Panel

18 x 2.5" Hot-swap Storage Bays
(8 x SATA/SAS/NVMe supported)

Rear Panel

1 1 x OCP 3.0 (Gen4 x16 link)

2 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

3 1 x OCP 3.0 (Gen4 x16 link)

4 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

5 1 x OCP 3.0 (Gen4 x16 link)

6 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

7 1 x OCP 3.0 (Gen4 x16 link)

8 1 x PCIe x16 slot, LP, HL (Gen4 x16 link)

1 1 x PCIe x16 slot, LP, HL
(Gen4 x16 link)

2 16 x DDR4 3200/2933

3 1 x OCP 3.0 (Gen4 x16 link) , optional

4 Dual 3rd Gen Intel® Xeon® Scalable Processors*

5 2 x M.2

*The TDP under 250W is set to be used air cooling. The TDP more than 205W is recommended on liquid cooling

TCO-optimized Cooling for Data Centers

Compute-intensive servers demand extremely power-efficiency and cooling solutions to disperse the heat generated from multiple CPUs. ASUS RS720Q-E10 offers either air or liquid cooling, depending on the CPU wattage, with Asetek’s Direct to Chip (D2C) liquid-cooling technology delivering improved power-usage effectiveness (PUE) for optimized data-center TCO.

D2C Ingredient Coolers

Drop-in replacements for air heat sinks that transfer heat out of the server with liquid.

Learn more about D2C Ingredient Coolers

InRackCDU™ for liquid-cooled data centers

Rack level D2C solution for liquid-cooled data centers.

Learn more about InRackCDU™

Cooling Solutions
Enhanced Security

ASUS RS720Q-E10 servers integrate PFR FPGA as the platform Root-of-Trust solution for firmware resiliency to prevent from hackers from gaining access to infrastructure. ASUS security solutions are fully compliant with the 2018 National Institute of Standards and Technology (NIST) SP 800 193 specification.

In addition, all RS720Q-E10 servers also include support Trusted Platform Module 2.0 (TPM 2.0) to secure hardware through integrated cryptographic keys and offer regular firmware update for vulnerabilities.

* Both PFR and TPM are options, available on request.

Enhanced security
OCP 3.0

ASUS RS720Q-E10 servers feature the latest OCP NIC 3.0 card with PCIe 4.0 bandwidth for a faster time-to-market network solution, delivering the speeds of up to 200 Gbps for high bandwidth and low latency. It also features a tool-less, hot-swappable design to simplify installation and serviceability.

OCP 3.0 ready
Server-management Solution
ASUS Control Center

ASUS ASMB10-iKVM is the latest server-management solution from ASUS, built upon the ASPEED 2600 chipset running on the latest AMI MegaRAC SP-X. The module provides various interfaces to enable out-of-band server management through WebGUI, Intelligent Platform Management Interface (IPMI) and Redfish® API.

Learn more about ASUS ASMB10-iKVM

ASUS Control Center

ASUS Control Center (ACC) is a centralized and integrated IT-management platform for monitoring and controlling ASUS servers, workstations and mini PCs. ACC enables remote BIOS updates, monitoring of multiple systems via mobile devices, and one-click software updates and dispatching, allowing easier server management for any IT infrastructure.

Learn more about ASUS Control Center

ASUS Control Center
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