TAIPEI, Taiwan, August 4, 2023 —ASUS IoT, the leading global AIoT solution provider, today announced Tinker Board 3N series, a versatile, Arm®-based single-board computer (SBC) that empowers easy system integration, broad adaptability and superb expandability — elevating it to the perfect choice for the emerging Industrial Internet of Things (IIoT) era. The NUC-sized SBC series is equipped with rich I/O and supports Linux Debian, Yocto, and Android operating systems, presenting an all-new premium option for developers and system integrators’ diverse IIoT projects. Its optimized thermal design simplifies deployment of embedded applications, ensuring efficient operation in demanding environments.
With its durable and reliable design, Tinker Board 3N offers enhanced computing performance, low power consumption and a wide range of interfaces, so it’s primed and ready for smart manufacturing applications powering the IoT revolution.
Versatile performance and advanced graphics processing
To deliver the raw power and versatility demanded by IIoT applications, Tinker Board 3N is equipped with a 64-bit, quad-core Arm Rockchip RK3568 processor. Built on the Arm v8 architecture, this generates remarkable GPU performance for seamless graphics processing with low power consumption. Exacting in-house tests show that Tinker Board 3N delivers up to 17%-higher GPU performance and up to 31% increase in total UX score1, encompassing data security, processing capabilities, and image and video processing. Tinker Board 3N excels in IoT gateway, human-machine interfacing (HMI), and factory automation.
Robust and resilient thermal design
In addition to its outstanding computing performance, Tinker Board 3N incorporates several mechanical design enhancements to facilitate embedded application use with flexibility. For example, it features a low-profile pushpin heatsink and SoC placement on the back side for added strength and ease of installation, with its diminutive NUC-scale dimensions allowing for SWaP-constrained space deployment and flexible system integration. It is also engineered to operate smoothly in harsh industrial environments, with an impressive operating-temperature range of -40 to 85°C in order to fulfill industrial automation needs.
Enhanced connectivity for diverse applications
Tinker Board 3N-series devices are equipped with PoE, LVDS, COM, and CAN bus interfaces, along with M.2 E and M.2 B slots to accommodate WiFi 5/6 and 4G/5G expansion modules for cloud computing. The onboard LVDS supports FHD output via dual channels, making it suitable for multiple display solutions, while embedded COM headers and CAN bus can be utilized in diverse applications, such as controllers and robotic arms, expanding the board's usability. Delivering enhanced computing performance, remarkable expandability and cost-effectiveness, Tinker Board 3N series is perfectly suited for industrial automation and smart factory environments. It fulfills the need for real-time communication, frictionless integration, long-term operation, and stringent revision control, making it an ideal choice for fulfilling the demands of versatile applications in these settings.
Support for the latest operating systems
Tinker Board 3N supports a variety of the latest and mainstream operating system platforms, catering to different development environment needs. Users can choose from Linux Debian, Yocto, and Android operating systems. The latest ASUS IoT SBC supports firmware over the air (FOTA) for both Android and Linux, ensuring regular software updates and system maintenance for efficient and optimal performance.
Tinker Board 3N is available in three distinct flavors to meet diverse project requirements. These include Tinker Board 3N PLUS, Tinker Board 3N and Tinker Board 3N LITE.
For more information about Tinker Board 3N and its availability, please visit https://tinker-board.asus.com/product/tinker-board-3N.html.